FOV 50.0 x 37.5mm
max PCB:510(W) x 680(D)mm
Weight Approx. 1250 kg
dimensions 1180(W) x 1450(D) x 1500(H)mm
Product description: Omron 3D AOI VT-S1080 SMT Inspection Machine, FOV 50.0 x 37.5mm, max PCB:510(W) x 680(D)mm, Weight Approx. 1250 kg, dimensions 1180(W) x 1450(D) x 1500(H)mm
Omron 3D AOI VT-S1080
Omron 3D AOI VT-S1080
Next generation 3D AOI
The VT-S1080 is the world’s most advanced 3D AOI system, designed for maximum System Performance and High-Quality Productivity. Designed for flexible manufacturing, saving manpower with innovative AI Programming.
First Pass Yield efficiency up to 99%
Industry-first MDMC Illumination: 3D imaging from all angles enables accurate inspection of complicated solder shapes
Elimination of Shadow and Secondary Reflection with 4-Direction MPS Projectors
Realization of Solder Wetting Direction directly relating to IPC Standards
Innovative AI tools that support skill-less labor-saving tuning
Full 3D compliance to IPC – based inspection
Advanced angle-view inspection of hidden solder joints
Developed with I4.0 in mind for advanced Machine to Machine communication
Multi-lateral system monitoring and Predictive Maintenance for 100%, utilization for Production
Global Library to maintain the same quality standard of manufacturing in all global sites
High reliability OCR / OCV image detection
Unique Single Hardware across all S10 Series Platform
Prepared for the next-generation hardware, camera/GPU/PC for higher detectability/speed capability
Features
s1080 features tab images misc
AI-assisted qualitative inspection conforming to international standards
Since values conforming to the standards are directly applied as inspection criteria, there is no dependency on the skill and expertise of the programmer.
AI technology to minimize programming and visual inspection efforts
1. AI self-optimization
2. Automatically acquire defect images for analysis and visualization of result data separation for AI-assisted defect determination
3. Visualization of the AI-determined settings
High-precision solder shape reconstruction
Equipped with our unique MDMC (Multi Direction/Multi Color) illumination and new MPS (Micro Phase Patented Shift) moiré technique. This enables higher robust and reliable inspection performance.
M2M*1 system focusing on quality
1. Preventing defects by:
monitoring and reporting fluctuations in the measured values during production
visualizing defect trends associated with chip mounter hardware such as heads and nozzles
2. Visualizing the quality by:
process comparison
displaying production status
linking SPI/AOI/AXI systems
3. Improving the first pass yield rate of the line by automatically calculating post-print/post-placement inspection criteria based on the inspection results after the solder reflow process
*1. Abbreviation of machine-to-machine. It is a mechanism to optimize the quality and equipment operation status without human intervention, made possible by enabling autonomous communication and exchange of information between various connected, production equipment.
*1. Abbreviation of machine-to-machine. It is a mechanism to optimize the quality and equipment operation status without human intervention, made possible by enabling autonomous communication and exchange of information between various connected, production equipment.
Type | VT-S1080 | |
Outer dimensions | 1180(W) x 1450(D) x 1500(H)mm | |
Weight | Approx. 1250 kg | |
Power supply | Voltage | 200 to 240 V AC (Single phase); Voltage fluctuation range ±10% |
Rated power | 2.0 kVA (Maximum current 10 A) | |
Line height | 900±20mm | |
Air supply | Not required | |
Operating temperature range | 10 to 35°C | |
Operating humidity range | 35 to 80% RH (Non-condensing) | |
Vision system | Imaging system | 12M pixel camera |
Inspection principle | MDMC*1 illumination + 3D reconstruction through MPS*2 technology | |
Image resolution | 12.5µm | |
FOV | 50.0 x 37.5mm | |
Supported PCB size | 50(W) x 50(D)～510(W) x 680(D)mm | |
Weight | (Max) 4 kg | |
Thickness | 0.4～4mm | |
Clearance | Above the conveyor belt: 54 mm or less; Below the conveyor belt: 50 mm or less (Including board thickness/curvature/bend/part tolerance, etc.) | |
Height measurement range | 25mm | |
Inspection item | Component height, lift, tilt, missing or wrong component, wrong polarity, flipped component, OCR inspection, 2D code, component offset (X/Y/rotation), fillet (height/length, end joint width, wetting angle, side joint length), exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge, distance between components, component angle | |
080
Next generation 3D AOI
The VT-S1080 is the world’s most advanced 3D AOI system, designed for maximum System Performance and High-Quality Productivity. Designed for flexible manufacturing, saving manpower with innovative AI Programming.
First Pass Yield efficiency up to 99%
Industry-first MDMC Illumination: 3D imaging from all angles enables accurate inspection of complicated solder shapes
Elimination of Shadow and Secondary Reflection with 4-Direction MPS Projectors
Realization of Solder Wetting Direction directly relating to IPC Standards
Innovative AI tools that support skill-less labor-saving tuning
Full 3D compliance to IPC – based inspection
Advanced angle-view inspection of hidden solder joints
Developed with I4.0 in mind for advanced Machine to Machine communication
Multi-lateral system monitoring and Predictive Maintenance for 100%, utilization for Production
Global Library to maintain the same quality standard of manufacturing in all global sites
High reliability OCR / OCV image detection
Unique Single Hardware across all S10 Series Platform
Prepared for the next-generation hardware, camera/GPU/PC for higher detectability/speed capability
Features
s1080 features tab images misc
AI-assisted qualitative inspection conforming to international standards
Since values conforming to the standards are directly applied as inspection criteria, there is no dependency on the skill and expertise of the programmer.
AI technology to minimize programming and visual inspection efforts
1. AI self-optimization
2. Automatically acquire defect images for analysis and visualization of result data separation for AI-assisted defect determination
3. Visualization of the AI-determined settings
High-precision solder shape reconstruction
Equipped with our unique MDMC (Multi Direction/Multi Color) illumination and new MPS (Micro Phase Patented Shift) moiré technique. This enables higher robust and reliable inspection performance.
M2M*1 system focusing on quality
1. Preventing defects by:
monitoring and reporting fluctuations in the measured values during production
visualizing defect trends associated with chip mounter hardware such as heads and nozzles
2. Visualizing the quality by:
process comparison
displaying production status
linking SPI/AOI/AXI systems
3. Improving the first pass yield rate of the line by automatically calculating post-print/post-placement inspection criteria based on the inspection results after the solder reflow process
*1. Abbreviation of machine-to-machine. It is a mechanism to optimize the quality and equipment operation status without human intervention, made possible by enabling autonomous communication and exchange of information between various connected, production equipment.
*1. Abbreviation of machine-to-machine. It is a mechanism to optimize the quality and equipment operation status without human intervention, made possible by enabling autonomous communication and exchange of information between various connected, production equipment.
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Type | VT-S1080 | |
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